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SEPRAYS at NEPCON 2026: Exhibition Highlights and Customer Insights

October 30, 2026 — By Seprays

NEPCON Shenzhen 2026 has officially come to an end, and over the past few days, the SEPRAYS booth welcomed many customers and partners from electronics manufacturing, SMT, automation, and related industries.

From on-site discussions and live machine demonstrations to deeper conversations about real production needs, the exhibition gave us the opportunity to connect directly with more customers and better understand current PCB depaneling applications and industry trends.

NEPCON & SEPRAYS exhibition site

1. A Busy Booth with Continuous Customer Discussions

Throughout the exhibition, the SEPRAYS booth remained active with visitors stopping by to learn more about different PCB depaneling solutions.

Many customers did more than simply look at the machines. They brought questions based on their own PCB and PCBA products and discussed their actual production requirements directly with our team.

Some of the most common topics included:

  • which depaneling process is suitable for different panel designs;
  • how to handle PCBAs with taller components;
  • how to reduce manual loading, unloading, and transfer;
  • the differences between routing, saw-blade cutting, and laser depaneling;
  • how depaneling equipment can be integrated with automated production lines.

These face-to-face conversations allowed us to understand real production challenges more clearly instead of discussing machine specifications alone.

2. Live Machine Demonstrations Made Different Depaneling Solutions Easier to Understand

During the exhibition, we also demonstrated several PCB depaneling solutions so visitors could see the machine structures, operation methods, and different cutting processes more directly.

Compared with only reviewing brochures or technical specifications, seeing the equipment in operation helps customers better understand which solution may fit their actual production environment.

ZM300H Router + Saw Blade PCB Depanelizer

The ZM300H combines independent router and saw-blade spindles in one offline machine, making it suitable for production environments that need to handle both routing and V-groove depaneling.

Its large dual-table design supports a maximum processing size of 370 × 420 mm, providing flexibility for larger PCB panels and different panel structures.

ZM300H Router+Saw Blade PCB Depanelizer

GAM385AT Downcut PCB Router Machine

The GAM385AT uses a bottom downcut routing structure and supports top-side component heights of up to 45 mm, making it suitable for PCBAs that require more clearance above the board.

It also uses fixture clamping and supports 0–180° rotation for different placement requirements after depaneling.

GAM385AT Downcut PCB Router Machine

ZAM330 PCB/FPC Laser Depaneling Machine

The ZAM330 uses non-contact laser processing to reduce mechanical pressure on the PCB or FPC during depaneling.

Green laser, UV, picosecond, and nanosecond options are available for different materials and precision requirements.

The machines themselves were only one part of the exhibition. More importantly, customers could discuss their actual PCB structure, material, production volume, component layout, and automation requirements with our team on site.

ZAM330 Laser Depaneling Machine

If you are also evaluating routing, saw-blade, or laser depaneling solutions, you can share your PCB / PCBA samples, board thickness, component height, and production requirements with us. Our team can help you evaluate a more suitable depaneling process.

3. Face-to-Face Discussions Helped Us Better Understand What Customers Really Need

One thing that became very clear during the exhibition is that customers are no longer focused only on how fast a machine can cut.

More customers are now asking about:

Production stability, changeover efficiency, automation, labor reduction, and consistent depaneling quality.

Different factories have very different production requirements.

Some customers focus on high-volume continuous production, while others need greater flexibility for multiple product types. Some are also looking for low-stress or non-contact depaneling methods for more demanding applications.

These conversations are valuable to SEPRAYS because they help us understand how PCB depaneling requirements are changing in real production environments.

This feedback also gives us more direction for future machine development and application optimization.

NEPCON & SEPRAYS Exhibition Collection

4. The Exhibition Was Also an Opportunity to Follow the Latest Industry Developments

NEPCON is not only a platform for displaying equipment. It is also an opportunity to learn more about the latest developments in electronics manufacturing.

During the exhibition, we saw more applications related to automation, smart manufacturing, SMT production, precision processing, and production data management.

Through discussions with customers, partners, and other industry professionals, we gained a clearer view of how PCB depaneling is continuing to develop.

Future depaneling solutions will not only focus on the performance of a single machine, but also on:

Automation integration, production efficiency, stable operation, data connectivity, and better coordination between different manufacturing processes.

These trends also provide useful insights for SEPRAYS as we continue to improve our products and application solutions.

Nepcon Exhibition Cooperation and Exchange

5. Thank You to Everyone Who Visited the SEPRAYS Booth

The exhibition passed quickly, but we are grateful for every customer, partner, and industry professional who visited the SEPRAYS booth, shared questions, and discussed real production applications with us.

From live machine demonstrations and technical discussions to conversations about new manufacturing trends, NEPCON Shenzhen 2026 gave us many new connections and valuable insights.

The exhibition may be over, but the conversations will continue.

If you are looking for a suitable PCB routing, saw-blade, laser, or automated depaneling solution, feel free to contact SEPRAYS.

You can also send us your PCB / PCBA samples, Gerber or DXF files, board thickness, component height, and target output so we can help evaluate a more suitable machine and process solution.

Email:millie@seprays.com

WhatsApp:+86 139 2552 7370

We look forward to meeting more customers and partners at the next exhibition.

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