ZAM330 PCB/FPC Laser Depaneling Machine

The ZAM330 is a dual-platform PCB/FPC laser depaneling machine designed for precision cutting of PCBAs, flexible circuits and complex profiles without mechanical contact.

Non-contact laser cutting eliminates mechanical cutting forces and vibration.
Dual-platform operation reduces loading and unloading downtime.
Green, UV, picosecond and nanosecond laser options support different processing requirements.
CCD target alignment and an industrial vacuum system support precise laser processing.

Send us your PCB/FPC material details, thickness and cutting drawings for a tailored ZAM330 laser depaneling solution and quotation.

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Details

Product Details

Overview

The SEPRAYS ZAM330 is a dual-platform PCB/FPC laser depaneling machine for precision cutting, complex contours and coverlay window opening. It features CCD vision alignment and supports multiple laser configurations for different materials and processing needs.

Core Advantages

Stress-Free Precision Laser Cutting

Non-contact laser cutting eliminates mechanical cutting forces and vibration, reducing deformation risks while supporting narrow kerfs and complex PCB/FPC contours.

Alternating Dual-Platform Processing

Dual platforms allow loading and cutting to alternate, while CCD pre-alignment reduces positioning time and improves production efficiency.

Flexible Laser Configurations

Green, UV, picosecond and nanosecond laser options accommodate different materials, thicknesses and cutting-quality requirements.

Application

What Materials and Products Can the ZAM330 Process?

The ZAM330 is suitable for precision laser processing of PCB, PCBA, FPC and other electronic materials that require fine cutting profiles and minimal mechanical stress.

Supported material applications include LCP, MPI, PI, PET, FR4, FR5, CEM, polyester, ceramic and other RF materials, depending on laser configuration and material thickness.

Typical applications include PCBA laser depaneling, FPC outline cutting, coverlay window opening and gold finger area cutting. The appropriate laser source and cutting parameters should be selected according to the material structure and required edge quality.

ZAM330 Laser Depaneling Case Study

ZAM330 PCB/FPC Laser Depaneling FAQ

1. What is the difference between the ZAM330 laser depaneling machine and a PCB router?

A PCB router uses a rotating cutting tool to separate boards, while the ZAM330 uses a laser beam without mechanical contact. Laser processing avoids mechanical cutting forces and is suitable for delicate materials, narrow cutting paths and complex outlines.

2. Can the ZAM330 cut flexible printed circuits (FPCs)?

Yes. The ZAM330 supports FPC outline cutting and coverlay window opening. Cutting performance depends on the FPC material, thickness, laser configuration and processing parameters.

3. What are the differences between ZAM310, ZAM330 and ZAM330D?

The ZAM310 uses a single platform with a 350 × 350 mm cutting area. The ZAM330 features dual platforms with a 350 × 400 mm cutting area. The ZAM330D adds dual laser heads for applications requiring greater processing capacity.

4. Does the ZAM330 use UV or green laser technology?

Both UV and green laser options are available, along with different pulse configurations. Selection depends on the material, thickness, cutting performance and heat-affected zone requirements.

5. Does laser depaneling cause heat damage to PCB/FPC materials?

Laser cutting involves thermal energy, and the heat-affected zone depends on the laser wavelength, pulse characteristics, material and processing settings. The appropriate laser process can help control heat effects.

6. What file formats does the ZAM330 support?

The machine supports common PCB manufacturing data formats, including Gerber, HPGL, Sieb & Meier, Excellon and ODB++, simplifying cutting-path preparation.

7. Can the ZAM330 process PCBAs after SMT assembly?

Yes. The ZAM330 can be used for PCBA depaneling after SMT assembly. Component layout, cutting clearance, PCB thickness and thermal sensitivity should be evaluated before selecting the process.

8. What information is needed for a ZAM330 quotation?

Please provide the PCB/FPC material, thickness, dimensions, Gerber files or cutting drawings, target production capacity and cutting-edge requirements. Details about carbonization, cutting taper and loading automation are also helpful.

Why Choose SEPRAYS?

SEPRAYS Operation and Maintenance Training

Operation and Maintenance Training

Helps production teams master machine operation to improve efficiency

SEPRAYS Remote Technical Support

Remote Technical Support

Provides efficient technical coordination and problem-solving capabilities

SEPRAYS 24/7 Service

24/7 Service

SEPRAYS 24/7 service support ensures rapid response to requests

SEPRAYS Regular Overseas Visits

Regular Overseas Visits

Regular overseas visits to facilitate face-to-face technical exchanges

Contact SEPRAYS

Looking for a laser depaneling solution for delicate PCBAs, flexible circuits or fine cutting profiles?

SEPRAYS can help evaluate the ZAM330 configuration according to your material type, thickness, cutting requirements and target production capacity.

Email: millie@seprays.com

WhatsApp: +86 139 2552 7370

Address: 5th Floor, B2 Building Research Center Songshan Lake Intelligent Valley, Liaobu Town, Dongguan City, Guangdong Province, China

Send us your PCB/FPC drawings and processing requirements to request a ZAM330 laser depaneling solution and quotation.

Parameter

Technical Specifications

Parameters	ZAM310	ZAM330	ZAM330D
Valid Cutting Size	350 × 350 mm	350 × 400 mm
Platform	Single Platform	Dual Platforms
Platform Material	Granite Platform
Machine Precision	±30 μm
Repeat Precision	±3 μm
X/Y Axis Resolution	1 μm
Supported Data Formats	Gerber, HPGL, Sieb & Meier, Excellon, ODB++
Laser Options	Green / UV / Picosecond / Nanosecond
Laser Wavelength	355 nm / 532 nm
Laser Power	Depends on Laser Configuration
Control Software	PulseForge
Camera Target Alignment System	Standard
Industrial Vacuum System	Standard
Operating System	Windows 10, Chinese Operation Interface
CCD Camera	1.6-Megapixel Industrial Camera
Operating Temperature	23°C ±1°C
Power Requirement	380V , 50 Hz，3.5KW
Dimensions (L × W × H)	1200 × 1280 × 1620 mm	1410 × 1530 × 1880 mm	1600 × 2100 × 1600 mm
Machine Weight	600 kg	1393 kg

What services do you provide?

We provide one-stop automated PCB depaneling solutions: laser, routing, punching and V-CUT.

Can your machines handle different thicknesses of PCBs?

Yes, our machines are designed to handle various PCB thicknesses. We can provide customization and options to ensure smooth processing of both rigid and flex boards.

What type of training do you provide for your machines?

We provide comprehensive on-site training, covering machine operation, maintenance, and troubleshooting. We also offer ongoing technical support via phone and email.

What after-sales services can you provide?

●Exclusive service:

We will give users feedback within 10 minutes on any problems they encounter when using the device and establish a 1V1 exclusive after-sales service group for users.

●Remote service:

Provide users with a 7*24H hotline based on feedback on fault information, analyze, locate, and solve the fault through remote telephone support,remote login, and other methods.

●On-site service:

Arrive at the work site within 8 hours and solve the problem within 1 working day. 2-4 days of training on equipment safety operation and application.Any breach of contract will be handled by the contract provisions.

●Service locations:

We have sales and service support in 31 countries and regions overseas, responding to customers’ current and future needs as soon as possible.

●Benchmark service:

Follow-up call after each visit; video tutorials + telephone guidance on parts replacement and equipment maintenance; free follow-up month in December every year. We continue to collect user suggestions, continuously update and iterate the software, improve user production quality and efficiency, and provide lifelong maintenance.

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