PCB/FPC Laser Machine
ZM550AT Secondary Micro Dedusting Machine

ZM550AT Secondary Micro Dedusting Machine

The ZM550AT is an automatic PCB/PCBA fine dust cleaning machine designed to remove residual particles from both sides of circuit boards after depaneling and other production processes.

  • Independent upper and lower vortex cleaning modules clean both sides of PCBAs simultaneously.
  • Four electrostatic ionizing units help release fine dust particles that cling to board surfaces.
  • Non-contact airflow cleaning avoids direct brush contact with delicate components and solder joints.
  • Supports inline or offline operation to fit different production arrangements.

Send us your PCB/PCBA dimensions, dust removal requirements and production line details for a tailored ZM550AT cleaning solution and quotation.

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Details

Product Details

    Overview

    The SEPRAYS ZM550AT is a secondary fine dust cleaning machine for PCBAs that require additional surface cleaning after depaneling or assembly processes. It uses high-speed rotating airflow to lift fine particles from board surfaces, then collects the loosened dust through a negative-pressure extraction and filtration system.

    Core Advantages

    Simultaneous Double-Sided Cleaning

    Independent upper and lower vortex cleaning mechanisms clean both sides of a PCBA in one cycle, reducing the need to flip the board. Their Z-axis positions can be adjusted separately to accommodate different component heights.

    Vortex Airflow & Static Elimination

    High-speed rotating airflow works with ionizing units to loosen fine particles, including electrostatically attached dust. This combination improves particle removal without mechanical brushing.

    Negative-Pressure Dust Collection

    Loosened dust is drawn into the extraction system and collected through gravity separation and filter bags. This helps prevent particles from spreading back into the cleaning area and allows centralized dust disposal.

    How It Works

    The ZM550AT combines vortex airflow, electrostatic neutralization and negative-pressure extraction to remove fine dust from PCB/PCBA surfaces without direct contact.

    Vortex Airflow

    Static Neutralization

    Dust Extraction

    Filtration & Collection

    Compressed air generates rotating airflow that loosens fine particles, while ionizing units help reduce static attraction on the board surface.

    Negative pressure draws the released dust into the filtration system, where particles are captured and collected for disposal.

    Application

    What PCB/PCBA Products Are Suitable for the ZM550AT?

    The ZM550AT is suitable for PCBAs that need fine dust removal after router depaneling, SMT assembly or other manufacturing processes. Its non-contact cleaning method is especially useful for assembled boards with components and solder joints that should not be cleaned by direct brushing.

    Typical applications include PCBA cleaning in automotive electronics, telecommunications equipment, consumer electronics and aerospace electronics manufacturing. The machine can be used where both sides of a circuit board require additional cleaning to reduce residual dust.

    ZM550AT Secondary Micro Dedusting Machine FAQ

    1. What is the ZM550AT secondary fine dust cleaning machine used for?

    The ZM550AT removes fine particles remaining on PCB/PCBA surfaces after depaneling or other production processes. It uses non-contact airflow cleaning together with dust extraction and filtration.

    2. Can the ZM550AT clean both sides of a PCB at the same time?

    Yes. Independent upper and lower vortex cleaning modules work simultaneously to clean both sides of the board without a separate flipping step.

    3. How is the ZM550AT different from a standard PCB dust extractor?

    A standard dust extractor mainly uses suction to collect loose particles. The ZM550AT combines rotating airflow, ionizing units and negative-pressure extraction to loosen attached dust before collecting it.

    4. Can the ZM550AT damage PCB components during cleaning?

    The machine uses non-contact airflow rather than mechanical brushes, avoiding direct brushing pressure on components and solder joints. Airflow settings should still be matched to the board design and component stability.

    5. What PCB thicknesses can the ZM550AT handle?

    The ZM550AT supports PCB thicknesses from 0.5 to 5.0 mm. Component height and the available clearance around the cleaning modules should also be considered.

    6. Can the ZM550AT be integrated into an existing SMT or PCB depaneling line?

    Yes. The machine supports inline or offline operation. Integration depends on board transfer arrangements, production direction and upstream/downstream equipment interfaces.

    7. Can the ZM550AT remove all types of PCB dust?

    Cleaning results depend on particle size, dust adhesion, board structure and process settings. Sample testing is recommended when specific cleanliness requirements must be met.

    8. What information is needed for a ZM550AT quotation?

    Please provide PCB/PCBA dimensions, board thickness, maximum component height, dust type, cleaning requirements and target production capacity. For inline integration, upstream and downstream equipment details are also helpful.

    Why Choose SEPRAYS?

    SEPRAYS Operation and Maintenance Training

    Operation and Maintenance Training

    Helps production teams master machine operation to improve efficiency

    SEPRAYS Remote Technical Support

    Remote Technical Support

    Provides efficient technical coordination and problem-solving capabilities

    SEPRAYS 24/7 Service

    24/7 Service

    SEPRAYS 24/7 service support ensures rapid response to requests

    SEPRAYS Regular Overseas Visits

    Regular Overseas Visits

    Regular overseas visits to facilitate face-to-face technical exchanges

    Contact SEPRAYS

    Need to remove fine dust from PCBAs after routing or other electronics manufacturing processes?

    SEPRAYS can help evaluate the ZM550AT cleaning configuration based on your board dimensions, component layout, dust conditions and production line requirements.

    Email: millie@seprays.com

    WhatsApp: +86 139 2552 7370

    Address: 5th Floor, B2 Building Research Center Songshan Lake Intelligent Valley, Liaobu Town, Dongguan City, Guangdong Province, China

Parameter

Parameter

    Technical Specifications

    • Parameters
      ZM550AT
    • Dust Removal Range
      350 × 300 mm
    • Cleaning Modules
      Upper: 3 Groups; Lower: 3 Groups
    • Process Table
      Single Worktable
    • Electrostatic Ion Modules
      Upper: 2 Groups; Lower: 2 Groups
    • Cleaning Cycle
      Settable
    • Operating Mode
      Inline or Offline
    • Maximum Moving Speed
      XY: 1000 mm/s; Z: 800 mm/s
    • Maximum Travel
      X: 860 mm; Y: 674 mm; Z: 100 mm
    • Cleaning Airflow Speed
      16 m/s
    • Cleaning Speed
      1–100 mm/s (Adjustable)
    • Operation Interface
      Touchscreen
    • Program Teaching Mode
      Built-in
    • Control Method
      PLC
    • XYZ Axis Drive
      AC Servo Motor
    • Applicable PCB Thickness
      0.5–5.0 mm
    • Power Requirement
      AC 220V / 50–60 Hz / 1.5 kW
    • Pneumatic Requirement
      0.6 MPa / 120 L/min
    • Dimensions (W × D × H)
      1450 × 1480 × 1885 mm
    • Machine Weight
      608 kg

What services do you provide?

    What services do you provide?

    We provide one-stop automated PCB depaneling solutions: laser, routing, punching and V-CUT.

    Can your machines handle different thicknesses of PCBs?

    Yes, our machines are designed to handle various PCB thicknesses. We can provide customization and options to ensure smooth processing of both rigid and flex boards.

    What type of training do you provide for your machines?

    We provide comprehensive on-site training, covering machine operation, maintenance, and troubleshooting. We also offer ongoing technical support via phone and email.

    What after-sales services can you provide?

    ●Exclusive service:

    We will give users feedback within 10 minutes on any problems they encounter when using the device and establish a 1V1 exclusive after-sales service group for users.

    ●Remote service:

    Provide users with a 7*24H hotline based on feedback on fault information, analyze, locate, and solve the fault through remote telephone support,remote login, and other methods.

    ●On-site service:

    Arrive at the work site within 8 hours and solve the problem within 1 working day. 2-4 days of training on equipment safety operation and application.Any breach of contract will be handled by the contract provisions.

    ●Service locations:

    We have sales and service support in 31 countries and regions overseas, responding to customers’ current and future needs as soon as possible.

    ●Benchmark service:

    Follow-up call after each visit; video tutorials + telephone guidance on parts replacement and equipment maintenance; free follow-up month in December every year. We continue to collect user suggestions, continuously update and iterate the software, improve user production quality and efficiency, and provide lifelong maintenance.

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