Overview

The ZM30-L separates pre-scored boards by guiding the V-groove into the circular-blade cutting path. The board moves along the guide while the lower circular blade drives the cutting action and the upper blade follows the groove.

Dual-blade and six-blade versions are available for different board thicknesses, cutting requirements and production setups.

Core Advantages

Three-Stage Six-Blade Cutting for Lower Stress

The six-blade version uses three blade groups—A, B and C—to complete approximately 40%, 40% and 20% of the cut in sequence.

By reducing the cutting amount in each stage, depaneling stress can be reduced by more than 80% compared with conventional single-cut separation.

Stable Cutting for Shallow V-Grooves

Multi-stage cutting improves blade guidance along the V-groove, helping prevent the blade from jumping out of the groove even when the V-CUT is shallow.

This makes the six-blade configuration suitable for boards where stable groove tracking is especially important.

Optional 1.2 m / 2.4 m Long Platform

The six-blade version can be equipped with a 1.2 m or 2.4 m stainless-steel platform for longer boards.

The extended platform provides additional support for feeding and positioning long PCB or aluminum substrate products.

Application

The ZM30-L is designed for straight-line depaneling of V-CUT aluminum substrates, V-groove PCB circuit boards, shallow V-CUT PCBs and substrates, PCBs or aluminum substrates with different widths, and long-strip aluminum substrates.

Customized board guides can be used for products with different widths, while the unlimited depaneling length makes the machine suitable for processing long boards and aluminum substrates.

ZM30-L Aluminum Substrate Depaneling Machine FAQ

1. Can the circular blades be reground?

Yes. The circular blades can be reground and reused multiple times, helping extend their usable service life.

2. How is cutting accuracy controlled on the six-blade version?

The cutting blades are calibrated using laser interferometer measurement, with blade-tip runout controlled within 0.02 mm.

3. Can the blade position be adjusted?

Yes. The upper and lower circular blades can be precisely adjusted, and X- and Y-direction adjustments are also available.

4. Is positioning assistance available for the long platform?

Yes. The optional stainless-steel platform can be configured with laser-scale positioning to assist board placement.

5. What information should I provide when requesting a quotation?

Please provide the board material, board length and width, thickness, V-groove depth, production requirements, and whether a 1.2 m or 2.4 m platform is required.

Why Choose SEPRAYS?

From daily operation to overseas support, SEPRAYS provides practical technical services to help customers use and maintain their PCB depaneling equipment more efficiently.

Contact SEPRAYS

Looking for a depaneling solution for long V-CUT aluminum substrates, shallow V-groove PCBs or other long-board products?

Send us your PCB or aluminum substrate drawing, board dimensions, thickness, V-groove depth and production requirements, and SEPRAYS will help you select the appropriate ZM30-L dual-blade, six-blade or long-platform configuration.

E-Mail:
millie@seprays.com

Address:
5th Floor, B2 Building Research Center Songshan Lake Intelligent Valley, Liaobu Town, Dongguan City, Guangdong Province, China

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