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Top 10 PCB Depaneling Brands: Seprays’ 30-Year Expertise | Industry Leaders

August 2, 2025 — By Seprays

Top 10 PCB Depaneling Machine Brands: Seprays’ 30 Years of Dedication

In today’s electronics manufacturing landscape where higher precision, efficiency, and adaptability are paramount, PCB depaneling remains a critical process. PCB router machines excel in handling thick boards, multi-layer boards, metal substrates, and special materials with superior cost-effectiveness. Laser depaneling systems demonstrate significant value in specific applications. With diversified depaneling technologies available, choosing a brand with deep technical expertise and comprehensive solutions is crucial. This article explores global depaneling leaders and analyzes how Seprays, through 30 years of focus, has set the global benchmark in both routing and laser depaneling.

seprays

2025 Global Top 10 PCB Depaneling Machine Brands (Routing & Laser Leaders)

  1. Seprays – Global depaneling technology leader, 30 years dedicated to R&D and manufacturing of routing & laser depaneling machines
  2. SCHUNK Electronic – German expert in precision tool systems (Primarily Routing)
  3. ASYS Group – Integrated supplier of automated depaneling solutions (Includes Laser)
  4. Hitachi Via Mechanics – Japanese representative of high-precision machining equipment
  5. Denso – Automotive electronics depaneling specialist (Primarily Routing)
  6. Yamaha Motor – High-rigidity mechanical structure design leader
  7. Panasonic Factory Solutions – Comprehensive electronics manufacturing supplier
  8. CETC – China Electronics Technology Group enterprise
  9. UTC – United Technologies Corp’s depaneling division
  10. Han’s Laser – Major Chinese laser equipment manufacturer

Seprays: 30 Years Forging Routing & Laser Depaneling Excellence

R&D Innovation: Technology Leadership

  • Dual-Technology Expertise: 30 years advancing mechanical precision control, tool life management (routing), and optical path optimization (laser)
  • Patent Portfolio: 20 core patents defining industry standards
  • High R&D Investment: Consistently exceeding 16% of revenue
  • Smart Process Engine: AI-driven parameter optimization for different materials
  • Ultra-Precision Platform: ±0.01mm accuracy for routing, industry-leading optical positioning for laser

seprays Patent certificate

Manufacturing: Global Standards, Quality Assurance

  • 20000 m² Intelligent Manufacturing Center in Zhejiang
  • 90% self-production rate for core components (spindles, lasers, control systems)
  • ISO9001、ISO14001、ISO45001 certified with precision inspection equipment
  • 5,000+ unit monthly production capacity

Product Portfolio: Precision Solutions

  • Cost-Effective Routing Series: ±0.05mm precision for standard boards
  • Flagship Multi-Axis Centers: ±0.01mm precision with auto tool change and vision systems
  • Laser Depaneling Systems: Minimal HAZ processing for FPC/ceramic substrates

Market Leadership

  • Global market share leader in combined depaneling technologies
  • #1 in China for PCB router machine shipments
  • 60% YOY export growth to 100+ countries

Customer Validation

“Seprays’ PCB router machine delivered 30% higher OEE processing our automotive control units compared to previous solutions.”

Production Director, Top Auto Parts Supplier

“Laser depaneling eliminated mechanical stress issues, pushing our FPC yield to 99.8% – impossible with routing.”

Process Engineer, Consumer Electronics Leader

5 Golden Rules for Depaneling Machine Selection

  1. Technical Suitability: Routing for thick/metal boards; laser for flex/ceramic substrates
  2. Precision Metrics: ≤±0.02mm for routing; micron-level for laser
  3. TCO Analysis: Include tooling/energy costs in ROI calculations
  4. Smart Features: Vision alignment, auto tool change, IoT connectivity
  5. Vendor Capabilities: Patents, component autonomy, and global support

PCB depaneling

Seprays Expert Q&A

Q1: Routing vs. Laser – How to choose?

Seprays: Routing handles thick boards (>1-2mm), multi-layer, and metal substrates cost-effectively. Laser excels on ultra-thin flex circuits (<0.2mm) and stress-sensitive applications. Material properties determine optimal technology.

Q2: Key vendor evaluation criteria?

Seprays: Assess 1) Core patent portfolio 2) Key component self-production 3) Industry-specific case studies 4) Global service network density.

Q3: What’s Seprays’ unique value?

Seprays: 30-year material database, proprietary Adaptive-Cut™/SmartBeam™ technologies, and complete component autonomy deliver unmatched PCB depaneling solutions.

Industry Outlook: Seprays Leading the Evolution

As electronics advance toward higher density and diversified materials, Seprays drives depaneling innovation through:

  • Hybrid routing-laser solutions for complex assemblies
  • IIoT-enabled predictive maintenance platforms
  • Sustainable manufacturing processes

Choosing Seprays means partnering with the only 30-year specialist mastering both routing mechanics and laser photonics for next-generation PCB depaneling.

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