As electronic devices evolve toward larger sizes and higher integration, oversized PCBs (typically those exceeding 600mm in length) are increasingly used in industrial control, communication base stations, new energy, and other fields. Depaneling these large PCBs presents unique challenges that require specially designed equipment and technical solutions.
Essential Functions for Oversized PCB Depaneling Machines
High-Rigidity Machine Structure
Oversized PCBs are prone to deformation due to their own weight during processing, requiring equipment with extremely high structural rigidity and stability. Gantry or bridge-type structures are generally more suitable, and the worktable surface needs precision grinding with sufficient support points.
Multi-Axis Precision Motion System
In addition to traditional X, Y, and Z axes, oversized PCB depaneling often requires a rotational axis (R-axis) to accommodate different cutting angles, with some applications needing tilt adjustment functionality. Linear motors or precision ball screws paired with high-resolution encoders are key to ensuring positioning accuracy.
Intelligent Vision Positioning and Correction
Due to material thermal expansion and incoming material tolerances, oversized PCBs often have deviations between their actual positions and design drawings. Multi-camera vision systems (typically 2-4 cameras) can recognize fiducial marks and circuit features in real-time, automatically compensating for positional deviations to ensure precise alignment of cutting paths.
Low-Stress Cutting Technology
For special PCBs like thick copper boards and high-frequency materials, traditional milling cutters can generate significant mechanical and thermal stress. Advanced equipment should offer multiple cutting options: spindle milling (suitable for most materials), laser cutting (for flexible boards and precision circuits), and combined applications of both.
Dynamic Support and Vacuum Fixturing
Programmable Z-axis support systems can automatically adjust support point positions based on PCB shape, combined with zoned vacuum adsorption to ensure the board remains flat during cutting, reducing vibration and deformation.
Dust Management and Thermal Control
The increased dust generated from large PCB cutting requires high-flow dust extraction systems for timely debris removal. For laser cutting models, temperature monitoring and cooling systems are also necessary to prevent heat accumulation from affecting processing quality.
Software and Automation Integration
Professional depaneling software should support multiple file formats including Gerber, DXF, and Excel, featuring path optimization and batch processing capabilities. It should also provide standard interfaces (SECS/GEM) for easy integration into automated production lines.
Seprays (Genitec) Solution: GTT Series Oversized PCB Depaneling Machine
Addressing these technical challenges, Seprays (leveraging Genitec’s manufacturing system) offers the GTT series depaneling machine specifically designed for oversized PCBs.
Technical Advantages and Details
Structural Design
Full cast iron gantry structure optimized through finite element analysis, with static stiffness below 0.05mm/m
Worktable sizes available from 1000mm×600mm to 2000mm×800mm, maximum processing length up to 1500mm
Motion System
Equipped with linear motor drives, repeat positioning accuracy ±0.01mm
Optional fourth rotational axis supporting 0-360° continuous rotation for complex contour separation
Cutting Technology
Spindle power 3.5kW, maximum speed 60,000rpm, suitable for PCBs up to 6mm thick
Optional UV laser module (355nm wavelength), minimum heat-affected zone <30μm
Vision System
Four-point positioning camera system with adaptive image algorithms, compensating for up to 0.5mm positional deviation
Supports barcode reading for automatic product information association
Stress Control
Integrated real-time spindle load monitoring, automatically adjusting feed rates to prevent overload
Cutting path optimization algorithms reduce stress concentration at sharp corners
Software Features
Genitec dedicated depaneling software with 3D simulation and collision detection
Production data tracking system recording processing parameters for each PCB
This equipment is particularly suitable for separating large electronic components like base station antenna boards, server motherboards, and new energy controllers, minimizing micro-cracks and delamination risks while ensuring separation precision.
